ASSIGNMENT代寫

新西蘭作業代寫 電路板是如何制作

2020-06-06 04:10

要了解電路板是如何制作的,他們首先需要了解焊接。焊接是將焊料熔化成液體以將電子元件綁定到焊接板上。焊料通常由錫和鉛制成。最常見的焊料由60%的錫和40%的鉛組成。當你焊接烙鐵的尖端變熱,所以小心不要觸摸它。每次用烙鐵捆扎東西時,必須清洗烙鐵頭。這背后的原因是烙鐵的尖端氧化,會使金屬臟,導致金屬不能正確地結合。在這個實驗中,焊料將被用來捆綁的Perf板與二極管。實驗中使用的特定二極管是LED。led是一種發出非相干單色光的半導體器件。一個LED包含一個充滿雜質的半導體芯片,形成PN結。led的顏色取決于材料中形成PN結的帶隙能量。在PN結中使用的材料給出了與近紅外、可見光或近紫外光相對應的帶隙能量。在實驗過程中,LED周圍會有散熱片,以防止它比沒有散熱片的情況下更快地油炸。用于實驗的散熱器將是被動散熱器。被動散熱器沒有活動部件,例如風扇。最常見的散熱器材料是鋁,因為它重量輕,導熱性好。有許多不同類型的被動散熱器。其中一些是保稅散熱器,skived散熱器和沖壓散熱器。
新西蘭作業代寫 電路板是如何制作
To understand how circuit boards are made, their first needs to be a understanding of soldering. Soldering is when solder is melted into a liquid to bind electrical components to a Perf Board. Solder is usually made of tin and lead. The most common solder is made up of sixty percent tin and forty percent lead. When you solder the tip of the soldering iron gets hot, so be careful not to touch it. Each time something is bound with the soldering iron, the tip of the soldering iron must be cleaned. The reason behind this is because the tip of the soldering iron oxidizes and can get the metal dirty causing the metal to not bind properly. The solder in this experiment will be used to bind the Perf Board with the diode. The specific diode that will be used in the experiment is a LED.LEDs are a semiconductor device that emits incoherent monochromatic light. A LED contains a chip of semiconducting impregnated with impurities make a PN junction. The color of the LEDs depends on the amount of bandgap energy in the materials forming the PN junction. The materials used in the PN junction give of this bandgap energy that corresponds to near-infrared, visible or near-ultraviolet light. During the experiment the LED will have a heat sink around it to prevent it from frying faster than it does without one.The heat sinks that will be used for the experiment will be passive heat sinks. Passive heat sinks have no moving parts, for example a fan. The most common material for a heat sink is aluminum because, it is light weight and has good thermal conductivity. There are many different types of passive heat sinks. A few of them are bonded heat sinks, skived heat sink and a stamped heat sink.
 
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